Minutes of EUDET ECAL mech & elec meeting on 12 Nov, 15h CET
written by Daniel Jeans
slides on
http://ilcagenda.linearcollider.org/conferenceDisplay.py?confId=4292
* Julien G. had problems connecting, we will hear his report next meeting.
* FEV7 status (Stephane Callier)
- 2 manufacturers have each produced 6*FEV7_COB
- thicknesses of 0.83/0.94 mm (0.781mm requested)
- seem to be of good quality, enough gold on pads
- bonding: quote of ~2kEURO for 2 boards (=8 chips)
hope that CERN can do this much cheaper
- still need to investigate resin covering for chip
- FEV7_CIP already used to test interconnections (Patrick)
- 2 example with 1 chip
- 1 example with 4 chips
- FEV7_COB2 designed, extra Cu layer on top, well for chip
- 1100 micron design depth
- one manufacturer OK price (+20% wrt cob1),
other much nore expensive than COB1
- only 1 manufacturer for present...
- send order next week
- will investigate together with Korean group next year
- SKIROC2: will be submitted Jan 2010 (with HR2)
- detailed layout of wafer still to be done
- several months of testing will be needed
* probe station @ Strasbourg
* report from Cambridge (Maurice Goodrick)
- ECAL DIFs: 10 already assembled (out of total of 40)
* initial tests look OK
* test setup being elaborated
* remaining DIFs assembled when tests all OK
- 250mm soldering lamp @ Cambridge for interconnects
- electronic control box in debugging
- bring to LAL when ready, hopefully (early) december
* budget (French groups)
- at SOCLE we heard ILC groups asked for ~3 times more money than available
(1.5M vs. (2.5M (total) - ~0.9M (LHC) )
- the cut will probably be applied unequally to various groups
- will certainly not be rich next year
- how many wafers do we need to buy for ECAL in 2010?
- will things be better in following years?
* next meeting, thurs 19 nov, 15h CET
- Julien G on thermal test results
- more details of budget 2010
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