EUDET-ECAL mechanics/electronics meeting
16/12/2009 on EVO 15:00 CET
minutes by Daniel (please send me corrections/ommissions)
status/plans of mechanics - Mickael Frotin
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- design of assembly mould delayed
- re-design of "stop parts" which hold cores in place
- careful about thermal expansion
- design should be done by end december
- order mould by end january 2010.
- pushes back timeline for "h" structure
* "u" will not be needed, it seems a thin enough FEV* is feasable
- 14 layers and alveolar structure aseembled in first half 2010
- "h" in second half 2010
- top and bottom plates (from grenoble) exist
- will be sent to LLR when necessary
- designed solder-less connector for ASU->adapter card
- in process of manufacture and assembly
- will get more details in a future meeting
- mould for 2.5m alveola will arrive soon at Grenoble (Denis)
- first alveola by end January (?)
thermal studies - Julien Giraud
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* first tests of leakless system
* 10m vertical range, 4mm pipe
* measure pressure at various points
data entered into excel to help formulate behaviour
* at +10m, pressure = -0.8 bar
* fixing of cooling system to EUDET module
- adjustable
- relatively easy to dismount (expect to do this ~10-20 times)
* discussion of supporting system for apater cards/DIFs/cables
- proposal for grooved plate on hinge to support cards
- Maurice will circulate drawings of DIFs (where/how to attach support)
- need more details on cable sizes and routing before firm design is made
- DIF-adapt connection is strong, maybe enought to support cables?
Planning for ECAL meeting 14/15 January 2010 - Daniel Jeans
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* afternoon of 15th dedicated to ECAL EUDET
* proposed agenda
ASU interconnects - Patrick Cornebise
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- tested connection of FEV (temperature) cards w/ Cambridge lamp
- cooling is too slow, giving bubbles in solder
* ventilation system needed?
- problem of unstable voltage in the lab...
- in contact with manufacturers for alternative connecting kapton
Happy christmas & new year to all!
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